Flash Processor Diagram

Flash Storage Processor
(NV7X)

Specifications

Host Interface:
  • PCIe Gen4 x4 (64Gb) with NVMe 1.4 (HMB/CMB/PMR for high performance enterprise application)
  • SATA Gen3 (6Gbps) for legacy interface product
  • USB 3.2 Gen2 (10Gb) for portable storage application
Memory Interface:
  • 3DNAND TLC/QLC, Programmable command method for next-generation NAND and Compatible with NAND Interface ONFI 4.2 & 5.0 up to 2.4GT/s
  • NAND ECC 4KB LDPC (Hard/Soft Decision) capable to support 1e-2 RBER
  • LPDDR4/5 up to 128Gb capacity via 3.2G/4.8G with RS error correction
Reliability:
  • Enhanced NAND Reliability with Dynamic Wear Leveling and Refreshing
  • Intelligent Sudden Power-off Recovery by firmware and hardware
  • End-to-End Data Protection
  • Smart Peak Power Control
  • Operating Temperature (Commercial 0 ~ +70°C and Industrial -40 ~ +85°C)
Low-Power Consumption Design:
  • Smart Peak Power Control
  • Low Power Design – HW Controlled IO/Low Clock & MCU
  • Supports ASPM : L0/L1/L1.1/L1.2 (PCIe only), DEVSLP (SATA only)
Security and others:
  • Full Disk Encryption (ATA SET SECURITY, TCG Opal 2.0, or Host Key Encryption)
  • AES-256 (FIPS-197 certified), ECB/CBC/XTS
  • NVS-RNG (ENT (P) certified)
  • Other cryptographic functions (SHA3-384/512, ECDSA, PBKDF)
Package and Interface (-S for SATA, -P for PCIe, -U for USB):
  • NV7X-S/P (BGA, 15 x 15mm with 441 balls) with DRAM
  • - NV7X-S/P/U (BGA, 9 x 12mm with 289 balls) DRAMless
Chip

Get the latest product features and specifications here for the Flash Storage Processor (NV7X)

Flash Storage Processor
(NVS3800-37/39/57/59)

Specifications

Host Interface:
  • SATA 6Gb/s, 3Gb/s and 1.5Gb/s
  • Native PCIe Gen2 x2/x4, NVMe
NAND Flash Memory Support:
  • 1y/1x/2x/3x nm SLC/MLC/eMLC/TLC from All NAND Vendors
  • ONFI 2.0/3.0 and Toggle 1.0/2.0 Interface up to DDR-533
  • HLNAND Interface with up to DDR-667
  • 4/8/16/32KB Page NAND
Max. Capacity:
  • 4TB with ONFI NAND and Toggle NAND
  • 24TB with HLNAND
Reliability:
  • Up to 128bit BCH ECC & Enhanced ECC for Metadata, Max. 2KB Unit
  • Enhanced NAND Reliability with Static & Dynamic Wear Leveling
  • Read Refresh by Bit Error Monitoring
  • 2 Dimension Data Randomization
  • 2-level Bad Block Management
  • Intelligent Sudden Power-off Recovery
  • Data Path Protection (DPP)
  • Hardware-based RAID
  • End-to-end Data Protection
Low-Power Consumption Design:
  • Smart Peak Power Control
  • Low Power Design – HW Controlled IO/Low Clock & MCU/HW Read-retry/28nm Process Technology
  • Supports ASPM : L0/L1/L1.1/L1.2 (PCIe only), DEVSLP (SATA only)
Security:
  • Full Disk Encryption with AES 128/256, XTS-AES
  • ECB/CBC/CRT Modes Support
  • TCG OPAL 2.0
Package:
  • 508-ball CABGA, 17 x 17mm, 0.65mm Ball Pitch
Chip

Get the latest product features and specifications here for the Flash Storage Processor (NVS3800-37/39/57/59)

Flash Storage Processor
(NVS3600)

Specifications

Host Interface:
  • SATA 6Gb/s, 3Gb/s and 1.5Gb/s support
  • Fully compliant with SATA 3.0 / ATA-8 ACS2 Standard
  • Asynchronous signal Recovery
  • Native Command Queuing (NCQ) : up to 32 commands
  • Power Saving Modes : HIPM, DIPM (Partial / Slumber mode)
Max Performance (based on NVS3600):
  • Sustained Read & Write : Max. 510MB/s (CDM, Seq, Random)
  • Random Read IOPS : over 70,000 (@4K blocks, IO Meter QD16)
  • Random Write IOPS : over 70,000 (@ 4K blocks, IO Meter QD16)
Flash Memory Support:
  • 2x/3x/4x/5x nm SLC / MLC / eMLC from all SSD vendors
  • ONFI Async and Sync / Legacy and Toggle Interface
  • Hybrid NAND Mode ( Up to 4 other kinds of NAND)
Reliability:
  • Up to 64bit BCH ECC & Enhanced ECC for Metadata
  • Enhanced NAND Reliability with Static & Dynamic wear leveling
  • Read Refresh by Bit Error Monitoring
  • 2 Dimension Data Randomization
  • 2-level Bad Block Management
  • Against Sudden power-off and Recovery
Low-Power Consumption Design:
  • Peak Power Control
  • Low Power Design
Security:
  • Full disk encryption
  • AES128/256 ECB/CBC/CTR
  • TCG OPAL (since Dec., 2013)
Chip

NVS3615
(Entry)

Max Capacity:
  • Up to 160GB
    (5channel x 4ways)
Package:
  • 289-pin FBGA
  • 12 x 12mm
  • 0.65mm pitch
No External DRAM:
  • Embedded mDDR
Application:
  • mSATA, NGFF
  • Ultrabook Cache, CFast
  • Other mobile devices
Chip

NVS3600 (Mainstream)

Max Capacity:
  • Up to 640GB
    (10channel x 8ways)
Package:
  • 508-pin CABGA
  • 17 x 17mm
  • 0.65mm pitch
External DRAM Support:
  • mDDR x32 or
    mSDR x32
  • 256Mbit to 2Gb
Application:
  • 1.8inch, 2.5inch SATA
  • PC, Desktop
  • Enterprise

Get the latest product features and specifications here for the Flash Storage Processor (NVS3600)

Solid state storage for the future

Imagine what you can do